Daniel S. Stringfield
Tel. (312) 775-8081
University of Illinois at Chicago, B.S., Mechanical Engineering
University of Illinois at Chicago, M.S., Mechanical Engineering
Chicago-Kent College of Law, J.D., high honors, Order of the Coif
Admitted to practice in Illinois. Member of the bars of the U.S. District Courts for the Northern District of Illinois, District of Colorado, Eastern District of Michigan, and the Eastern District of Texas. Member of the Northern District of Illinois Trial Bar. Registered to practice before the U.S. Patent and Trademark Office.
A member of the Northern District of Illinois Trial Bar, Dan Stringfield has litigated cases, including as the first-chair and second-chair attorney, before the U.S. District Courts and the International Trade Commission (ITC). Danís litigation experience has involved a variety of technologies, including medical devices, sporting goods, chemical manufacturing processes, hardware and software for consumer electronics, user interface designs and features, mobile device apps, and e-procurement business methods and software.
Danís practice includes negotiating with, and defending suits brought by, non-practicing entities. Dan recently served as lead counsel defending one such suit and successfully litigated that case towards dismissal of all claims with prejudice and no money paid by our client.
Danís practice further includes intellectual property transactions, licensing, and due diligence.
Before joining McAndrews, Dan worked at a non-profit engineering consulting firm that performed energy conservation and productivity improvement studies at industrial facilities.
Dan graduated with high honors from Chicago-Kent, serving as a Notes and Comments Editor for the Chicago-Kent Law Review and winning awards for Best Brief and Best Oral Argument in the schoolís IP-focused Giles Rich Moot Court Competition. Upon graduation, Dan was elected into the Order of the Coif by vote of the Chicago-Kent faculty.
Dan received a Bachelor of Science and a Master of Science in Mechanical Engineering, both from the University of Illinois at Chicago. Danís graduate work focused on computational heat transfer, thermal modeling and energy conservation technologies.
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